New Delhi [India], September 17 (ANI): On Thursday, Prime Minister Narendra Modi marked the official opening of SEMICON India 2026 at the Yashobhoomi Convention Centre in New Delhi, initiating a three-day event dedicated to the country’s semiconductor and electronics sectors.

The convention, taking place from September 17 to 19, aims to foster industry collaboration, shape policy directions, and establish international partnerships.

As per government statistics, India’s electronics manufacturing has seen substantial growth over the past 11 years, with production of electronics goods surging nearly six times and mobile phone exports experiencing a staggering 127-fold increase from 2014-15 to 2024-25.

The expansion of the electronics manufacturing industry aligns with the AtmaNirbhar Bharat initiative, which envisions India becoming a global manufacturing leader. The government has implemented a systematic and focused strategy for electronics manufacturing throughout the entire value chain, including the semiconductor segment.

The production of electronics goods rose from approximately Rs 1.9 lakh crore in 2014-15 to around Rs 12 lakh crore by 2024-25, reflecting a six-fold growth. Additionally, electronics exports surged from Rs 38,000 crore to about Rs 3.3 lakh crore during the same timeframe, marking an eight-fold increase.

Mobile phone production saw an increase from Rs 18,000 crore in 2014-15 to Rs 5.45 lakh crore by 2024-25, representing a 28-fold rise. Meanwhile, mobile phone exports grew from Rs 1,500 crore to Rs 2 lakh crore, with the share of imported mobile phones plummeting from 75 percent of total demand to a mere 0.02 percent.

To stimulate the development of a comprehensive semiconductor manufacturing ecosystem in India, the government launched the Semicon India Programme in January 2022, encompassing design, fabrication, assembly, testing, packaging, and module manufacturing.

In just four years, the government has sanctioned 10 semiconductor projects, attracting investment commitments of approximately Rs 1.6 lakh crore. Commercial production has begun at two facilities, Micron and Kaynes, with two additional plants anticipated to start operations within the year.

The government is also advancing India’s chip design ecosystem by offering chip design tools from eight different companies to 315 universities at no cost. These tools have accumulated over 200 lakh hours of usage, with 211 chips designed by 75 institutions across the nation.

Furthermore, the government has approved 24 projects related to semiconductor chips and SoCs, targeting various sectors such as video surveillance, drone detection, energy metering, microprocessors, satellite communication, broadband, and IoT SoCs.

Among these projects, 14 companies have successfully garnered over Rs 650 crore in venture capital to scale up and commercialize their solutions. Seven chips have been fabricated at different nodes, including advanced nodes such as 12 nm.

To enhance bilateral cooperation on resilient semiconductor supply chains, the government has signed memoranda of understanding (MoUs) with the United States, Japan, the European Union, Singapore, and the Netherlands.

The growth in electronics manufacturing has also yielded significant employment opportunities. Industry estimates suggest that the sector supports roughly 25 lakh direct and indirect jobs, with around 12 lakh jobs attributed to mobile phone manufacturing, including roles in manufacturing, logistics, supply chains, and related services.

As part of the India Semiconductor Mission, 10 semiconductor units are currently under construction. Additionally, 249 applications have been submitted under the Electronics Component Manufacturing Scheme, covering components, base materials, and capital equipment like PCBs, capacitors, and laminates.

The approved semiconductor manufacturing projects, with an investment commitment of around Rs 1.6 lakh crore, will span across six states, including Gujarat, Assam, Uttar Pradesh, Odisha, Punjab, and Andhra Pradesh.

These projects encompass various advanced semiconductor technologies, including semiconductor fabrication, assembly, testing, packaging, and display driver ICs.

Micron Technology Inc. is establishing a semiconductor manufacturing facility in Gujarat with an investment of Rs 22,516 crore, focusing on the assembly and testing of DRAM and NAND products for both domestic and international markets, with a production capacity of approximately 14 million units weekly.

Tata Electronics Private Limited (TEPL) is also setting up a semiconductor facility in Gujarat, investing Rs 91,526 crore. This facility will be developed in collaboration with PSMC from Taiwan and will have a production capacity of about 50,000 wafer starts monthly.

Additionally, TEPL is building another semiconductor manufacturing site in Assam, investing Rs 27,120 crore, which will utilize indigenous semiconductor packaging technologies with a daily production capacity of 48 million units.

In Gujarat, CG Power and Industrial Solutions Limited is establishing a semiconductor manufacturing plant with an investment of Rs 7,584 crore as a joint venture with Renesas Electronics America Inc. and STARS Microelectronic from Thailand, expected to produce around 15.07 million units daily.

Kaynes Technology India Limited is developing a semiconductor manufacturing facility in Gujarat with an investment of Rs 3,307 crore focused on wire bond interconnect and substrate-based packages, capable of producing over 6.33 million chips daily.

In Uttar Pradesh, Vama Sundari Investments (Delhi) Private Limited is launching a semiconductor manufacturing facility with a Rs 3,706 crore investment for display driver ICs, using Gold Bump technology, and chip probing services in partnership with Foxconn India. This facility will have a monthly production capacity of around 20,000 wafers or 36 million chips.

Odisha is set to host two semiconductor facilities: 3D Glass Solutions Inc. is investing Rs 1,943 crore to assemble packaged products, glass interposers, and 3D heterogeneous integration modules, while SiCSem Private Limited is establishing a plant with an investment of Rs 2,066 crore, with a production capacity of 5,000 wafers monthly and packaging capacity of eight million units monthly.

In Punjab, Continental Device India Private Limited is expanding its facility with an investment of Rs 117 crore to produce high-power discrete semiconductor devices, including MOSFETs and IGBTs, with an annual production capacity of approximately 158.38 million units.

Lastly, in Andhra Pradesh, Advanced System in Package Technologies Private Limited is investing Rs 480 crore to set up a semiconductor manufacturing facility in partnership with APACT Co. Ltd. from South Korea, anticipated to produce around 96 million units annually.