The Odisha government has finalized a significant agreement with Intel and 3D Glass Solutions (3DGS) from the United States. A memorandum of understanding was signed on May 28, 2026, in California, with the goal of introducing advanced substrate manufacturing technology to India. This extensive project will attract $3.3 billion (approximately ₹27,500 crore) in investments across multiple phases.

The initiative plans to establish an advanced packaging substrate manufacturing facility in Odisha, marking the first of its kind in the country. Intel will take a leading role by providing its extensive technical expertise, licensing support, stringent quality control, and training programs for employees. The new facility will feature cleanrooms, high-tech fabrication units, specialized testing setups, and a dedicated research and development wing.

From a technological perspective, the facility will focus on advanced glass-based substrate technology and high-density interconnect packaging, which are essential for next-generation electronics, AI systems, high-speed computing, and telecommunications networks. The economic impact is expected to be substantial, with the project projected to create around 1,800 direct, highly skilled jobs, along with numerous indirect job opportunities.

Union Minister for Electronics and IT, Ashwini Vaishnaw, praised all parties involved and described the agreement as a significant advancement for India’s rapidly evolving semiconductor sector.